The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2001

Filed:

Dec. 30, 1997
Applicant:
Inventors:

Osamu Furukawa, Sagamihara, JP;

Hitoshi Chiyoma, Asahikawa, JP;

Kazuhisa Yabukawa, Himeji, JP;

Kenichi Donuma, Koshigaya, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 4/108 ;
U.S. Cl.
CPC ...
H01L 4/108 ;
Abstract

An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device,having a main surface thereon having a transducer portion,and wiring patterns,connected electrically to the transducer portion; a printed circuit board,having wiring patterns,formed at least on one main surface thereof; a plurality of conductive bumps,which connect electrically both of the mutually opposed wiring patterns and form a space portion,between the surface acoustic wave device,and a printed circuit board,; and resin portion,which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device,and seals the device,together with the printed circuit board,, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.


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