The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Oct. 07, 1998
Applicant:
Inventors:
Yasushi Shiraishi, Tokyo, JP;
Kazuhiko Sera, Tokyo, JP;
Etsuo Yamada, Tokyo, JP;
Kenji Nagasaki, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
In a semiconductor device,according to the present invention, a plurality of inner leads are bonded to a front surface of a semiconductor element,covered by a package,, with bent portions,formed at some inner leads,among the plurality of inner leads,and the front ends of the bent portions,exposed at a front surface of the package,. This structure ensures that the semiconductor element is not caused to move vertically inside the forming die by the pressure of the liquid resin or the like during the sealing process.