The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Aug. 24, 1999
Applicant:
Inventors:
Assignee:
Daido Tokushuko Kabushiki Kaisha, Aichi, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/301 ;
U.S. Cl.
CPC ...
B23K 1/301 ;
Abstract
A diffusion bonding method having a step of adjusting ends of material to be bonded before bonding the material after setting the materials in the diffusion bonding apparatus, whereas a diffusion bonding apparatus having a means of finishing ends of materials to be bonded so that both ends face parallel to each other.
Tsuchiya, Masaki. (2001). Apparatus for aligning ends of diffusion bonded materials (U.S. Patent No. 6262403). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6262403
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile