The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Jul. 30, 1999
Applicant:
Inventors:
Susan K. Radford, Fort Collins, CO (US);
Gerald J. D'Amato, Loveland, CO (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/124 ;
U.S. Cl.
CPC ...
H01L 2/124 ;
Abstract
The present invention provides a hybrid chip package that utilizes a high-speed BGA structure and a plurality of flexible and reliable QFP leads. More specifically, the QFP leads are attached to a peripheral region of a substrate to surround the attached BGA structure and replace solder bumps of a conventional BGA structure that would typically flack or crack during operational cycles to create an electrical open between the conventional BGA package and the attached printed circuit board.