The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Nov. 06, 1995
Applicant:
Inventors:
Klaus-Dieter Nittel, Frankfurt am Main, DE;
Karl-Heinz Nuss, Neu-Isenburg, DE;
Assignee:
Metallgesellschaft Aktiengesellschaft, Frankfurt am Main, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/18 ;
U.S. Cl.
CPC ...
B05D 1/18 ;
Abstract
Disclosed is a process for the electroless deposition of a copper coating on an iron or iron alloy surface wherein the workpiece surface is contacted with a solution which contains hydrogen ions, 5 to 30 g/l Cu as well as 0.2 to 5 g/l Mg and preferably copper and magnesium with a weight ratio of Cu:Mg of (35 to 5):1 for a treatment time of 3 sec to 15 min at a temperature of the solution of 20 to 65° C.
Nittel, Klaus-Dieter. (2001). Process for the electroless deposition of copper coatings on iron and iron alloy surfaces (U.S. Patent No. 6261644). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6261644
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile