The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2001

Filed:

Mar. 10, 1995
Applicant:
Inventors:

Hideaki Ikeda, Saitama-ken, JP;

Masanori Kosugi, Saitama-ken, JP;

Shizuo Kimura, Saitama-ken, JP;

Mamoru Matsuo, Tokyo, JP;

Tsutomu Tagata, Tokyo, JP;

Nobuyuki Matsumoto, Tokyo, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22F 1/04 ;
U.S. Cl.
CPC ...
C22F 1/04 ;
Abstract

The present invention disclosed is an aluminum alloy plate for super plastic molding capable of cold pre-molding before super plastic molding. The alloy plate comprises Mg at from 2.0 to 8.0% (weight %, the same shall apply hereinafter) Be at from 0.0001 to 0.01%, at least one of Mn at from 0.3 to 2.5%, Cr at from 0.1 to 0.5%, Zr at from 0.1 to 0.5% and V at from 0.1 to 0.5%. Additionally, the alloy plate may comprise an Fe amount and an Si amount each within a range of 0.0 to 0.2%; amounts of Na and Ca within ranges of 3 ppm or less and 5 ppm or less, respectively; while the remainder of the alloy plate consists of Al and inevitable impurities. The resulting alloy plate a crystalline structure is a non-recrystallized crystal structure; the 90° critical bending radius is 7.5 times the plate thickness or less; and the yield strength ratio before and after the final annealing is 70% or more. The invention also discloses production methods for the alloy plate.


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