The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Aug. 05, 1999
Loïc Renard, Milan, IT;
Battista Vitali, Romano di Lombardia, IT;
STMicroelectronics S.r.l., Agrate Brianza, IT;
Abstract
A method for forming and bonding a metal bump on a metal pad of an integrated circuit and successively stamping a vertex of the bonded metal bump is performed using the same capillary tool. The dielectric and refractory tip of the capillary tool ends with a flat surface forming a sharp edge adjacent a concave mouth formed therein. A preformed metal ball held in the concave mouth is bonded to the metal pad of the integrated circuit. The method further includes the step of retracting the capillary tool from the bonded metal bump while allowing free movement of the capillary tool relative to the metal wire passing through an axial conduit of the capillary tool. Relative movement of the metal wire is blocked by clamping the metal wire as soon as the capillary tool is pulled off the bonded metal bump. The capillary tool is then laterally shifted for breaking off the metal wire. The vertex of the bonded metal bump and a residual wire stump is stamped forming a substantially flat and leveled contact area by re-lowering the capillary tool previously misaligned from the bonded metal bump. The wire clamp is released and the capillary tool is lifted and moved to the next metal pad with a portion of the metal wire emerging from the concave mouth.