The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Oct. 13, 1999
Applicant:
Inventors:
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 ; G01L 9/16 ;
U.S. Cl.
CPC ...
G01L 9/00 ; G01L 9/16 ;
Abstract
A semiconductor pressure sensor chip is mounted on a recess of a resin package, and is electrically connected to bonding pads on the bottom of the recess through bonding wires. The recess is filled with a first protective member having a relatively large Young's modulus and a second protective member having a relatively small Young's modulus. The first protective member covers the bonding pads, and the second protective member is disposed on the first protective member and covers a diaphragm of the sensor chip. Accordingly, voids are prevented from being produced without preventing displacement of the diaphragm.