The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Dec. 14, 1999
Applicant:
Inventors:
Nobushige Moriwaki, Izumo, JP;
Shigeki Nishiyama, Izumo, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/005 ; H01G 4/228 ;
U.S. Cl.
CPC ...
H01G 4/005 ; H01G 4/228 ;
Abstract
A coating layer composed of a solder containing tin as the major component and a metal such as copper or silver which is the same as that contained in a external electrode in an amount greater than the eutectic concentration, is formed on the external electrode. The solder can suppress the solid-phase diffusion without formation of the barrier layer.
Moriwaki, Nobushige. (2001). Electronic component (U.S. Patent No. 6259593). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6259593
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile