The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2001

Filed:

Jan. 26, 1998
Applicant:
Inventors:

Yoshitaka Sasaki, Yokohama, JP;

Makoto Yoshida, Saku, JP;

Nobuya Oyama, Saku, JP;

Tsutomu Koyanagi, Saku, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/39 ;
U.S. Cl.
CPC ...
G11B 5/39 ;
Abstract

An inverted hybrid type thin film magnetic head including a substrate, an inductive recording element provided on the substrate and a magnetoresistive reading element provided on the inductive recording element. The inductive recording element having a first magnetic film provided on an inner surface of a recessed portion formed in the surface of the substrate and on the surface of the substrate to constitute a pole portion, a thin film coil formed within the recessed portion, a gap film formed on the pole portion of the first magnetic film and on an insulating film which supports and isolates coil turns, and a second magnetic film applied on the gap film and having a pole portion which is opposed to the pole portion of the first magnetic film via the gap film. The magnetoresistive reading element includes a magnetoresistive film formed within a shield gap film provided on the second magnetic film and a third magnetic film formed on the shield gap film. The pole portion of the second magnetic film is preferably formed by a protrusion projecting into a groove. A bonding pad electrically connected to one end of the thin film coil is provided on a side wall of a slider such that a center of the bonding pad situates within a pattern of the coil. Remaining bonding pads connected to the other end of the coil as well as to both ends of the magnetoresistive film are also provided on the side wall of the slider.


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