The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Nov. 22, 1999
Qiang Wu, Tokyo, JP;
Yoshihiro Tomita, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
There is described a circuit electrode formed in an integrated circuit package, which imparts sufficient bonding strength to a soldered section and prevents oxidation of the surface of an Ni—P film without fail. A circuit electrode to be electrically connected to a pattern formed on an organic substrate is formed. An electroless high-concentration Ni—P plating film containing phosphorous at a concentration of 7 to 12 wt. % is formed to a thickness of 3 to 10 &mgr;m so as to cover predetermined portions of the pattern. An electroless low-concentration Ni—P plating film containing phosphorous at a concentration of 3 wt. % or less is formed to a thickness of 0.5 to 10 &mgr;m so as to cover the electroless high-concentration Ni—P plating film. An electroless gold plating film is formed, as an oxidation prevention film, to a thickness of 0.05 to 0.5 &mgr;m so as to cover the surface of the electroless low-concentration Ni—P plating film.