The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Apr. 30, 1999
Hiromitsu Takeda, Tokyo, JP;
Michihiko Ichinose, Tokyo, JP;
Takehito Inaba, Tokyo, JP;
Ken Fukamachi, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A hybrid leadframe has first conductive leads extending into space over a semiconductor chip and second conductive leads outside the space, the first conductive leads and the second conductive leads are connected through bonding wires to bonding pads on the semiconductor chip, and the first conductive leads are directly adhered to insulating adhesive compound layers spread on predetermined area of the upper surface of the semiconductor device, wherein the second conductive leads are bifurcated so that one of the bifurcated portions is connected through the bonding wire to the bonding pad and the other bifurcated portion is adhered to the insulating adhesive compound layers so as to enhance the stability of the second conductive lead.