The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2001

Filed:

Nov. 15, 1999
Applicant:
Inventors:

Chikashi Okayama, Ichihara, JP;

Takanori Nakashima, Ichihara, JP;

Yuya Ishimoto, Ichihara, JP;

Shinji Nakata, Ichihara, JP;

Yasuhiro Mochizuki, Chiba, JP;

Shinichi Akitaya, Ichihara, JP;

Yoshitaka Sumi, Ichihara, JP;

Assignee:

Chisso Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08I 8/00 ;
U.S. Cl.
CPC ...
C08I 8/00 ;
Abstract

An unoriented polypropylene-based film or sheet possessing excellent impact resistance at low temperature, transparency, heat resistance at low temperature and excellent tear strength and/or stress whitening resistance. A molding material which comprises a polypropylene-based resin material comprising 40 to 80% by weight of crystalline polypropylene and 60 to 20% by weight of propylene-&agr;-olefin copolymer containing 20 to 80% by weight of propylene polymerization units, the propylene-&agr;-olefin copolymer dispersed as particles in the crystalline polypropylene, is unoriently molded to afford a film-shaped or sheet-shaped molding, wherein the particle diameter have an aspect ratio (L/D) of mean dispersed particle length (L) to mean dispersed particle diameter along the thickness of the molding (D) of 30 or more in a cross section of the molding along the MD direction, and the mean dispersed particle diameter of 0.3 &mgr;m or less.


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