The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Jun. 20, 2000
Applicant:
Inventors:
Seishi Oida, Kyoto, JP;
Yukio Yamaguchi, Shiga, JP;
Nobuhiro Suematsu, Kyoto, JP;
Takeshi Morikawa, Shiga, JP;
Yuichiro Yamada, Kyoto, JP;
Assignee:
Matsushita Electronics Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 7/070 ; B29C 3/368 ; B29C 4/502 ;
U.S. Cl.
CPC ...
B29C 7/070 ; B29C 3/368 ; B29C 4/502 ;
Abstract
According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.