The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Jul. 26, 2000
William B. Walkup, Hillsboro, OR (US);
Hon Hai Precision Ind. Co., Ltd., Taipei Hsien, TW;
Abstract
A soft internal touch contact (,) for a Land Grid Array (LGA) socket (,) for interconnecting an LGA package (,) with a printed circuit board (PCB) (,) comprises first and second spring arms (,) on opposite ends thereof, and a solder portion (,) between the first and second spring arms for being soldered to the PCB. The first and second spring arms have first and second free end sections (,) respectively defining a downwardly and an upwardly facing inclined surfaces (,) for engaging with each other thereby establishing a shortened electrical path between the LGA package and the PCB. Upon downward deflection of the first spring arm by the LGA package to engage with the second spring arm, the second spring arm correspondingly yields downward whereby a wiping action is generated between the downwardly and upwardly facing inclined surfaces along a direction substantially tangential to the inclined surfaces and also between the first spring arm and a contact pad (,) of the LGA package. To relieve stresses, a pair of wings (,) is formed on the solder portion to be loosely received in slots (,) in an insulative housing (,) of the LGA socket.