The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2001

Filed:

May. 23, 2000
Applicant:
Inventors:

Masuo Koshi, Ikoma, JP;

Tadahiko Sugimoto, Kadoma, JP;

Hiroaki Nakayama, Neyagawa, JP;

Kenichirou Todoroki, Hirakata, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 ; B23K 1/08 ; B23K 3/06 ;
U.S. Cl.
CPC ...
H05K 3/34 ; B23K 1/08 ; B23K 3/06 ;
Abstract

A jet solder feeding device allowing the molten solder ejected from ejecting ports to be kept at a desired height in a stable manner. The molten solder is ejected and fed from multiple ejecting ports formed on a corrugated plate, each wall portion surrounding the multiple ejecting ports formed on the corrugated plate is projected upward by coining or extrusion. This configuration allows the molten solder introduced under the corrugated plate to be satisfactorily guided by the conically shaped wall portion which surrounds each ejecting port and projected upward. Thus the molten solder ejected from the ejecting ports can be kept at a desired height, and in addition, its state is satisfactorily maintained in a stable manner.


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