The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
Mar. 20, 2000
Toshiaki Kaminaga, Naka-machi, JP;
Katsuaki Fukatsu, Urizura-machi, JP;
Ryoichi Kobayashi, Tojai-mura, JP;
Other;
Abstract
A less-deformable resin-sealed electronic apparatus of high reliability capable of increasing the robustness (long life-time) of soldered portions of a power semiconductor device for use in internal combustion engines while increasing the physical stiffness of an overall apparatus structure for achieving enhanced resistance to flexure or bending stresses is provided. A hybrid IC substrate,and power semiconductor device,are mounted on a metallic heat sink,. The power semiconductor device,is coupled and contacted with the heat sink,by use of an Sn—Sb alloy-based solder material,. The power semiconductor device,and hybrid IC substrate,plus heat sink,as well as input/output terminals,-,to,-,are embedded in a package,except for part of the input/output terminals, which package is made of epoxy at 70 to 90 weight percent (%) of an inorganic loading or filler material as machined by transfer mold techniques.