The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Mar. 16, 1999
Applicant:
Inventors:
Shinji Yoshihara, Nagoya, JP;
Sumitomo Inomata, Toyota, JP;
Kinya Atsumi, Okazaki, JP;
Minekazu Sakai, Kariya, JP;
Yasuki Shimoyama, Anjo, JP;
Tetsuo Fujii, Toyohashi, JP;
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 1/00 ; H05K 7/20 ; H01L 2/312 ; H01L 2/348 ;
U.S. Cl.
CPC ...
G01P 1/00 ; H05K 7/20 ; H01L 2/312 ; H01L 2/348 ;
Abstract
A heat resisting resin sheet is bonded to a semiconductor chip as a protective cap for protecting a beam structure provided on the semiconductor chip, through a heat resisting adhesive. The heat resisting resin sheet is composed of a polyimide base member and the heat resisting adhesive is composed of silicone adhesive. The heat resisting resin sheet is not deformed during a manufacturing process of the semiconductor chip. In addition, grinding water does not invade into the semiconductor chip during dicing-cut.