The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Dec. 01, 1999
Applicant:
Inventors:
Masaki Adachi, Yokohama, JP;
Megumi Yamamura, Ibo-gun, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/329 ;
U.S. Cl.
CPC ...
H01L 2/329 ;
Abstract
A composition for sealing a semiconductor device contains polyphenylene sulfide wherein a line expansion coefficient at 150° C. to 200° C. is 4.75×10,[1/°C.] or less, a line thermal expansion coefficient at 80 to 130° C. is 6.0×10,[1/°C.] or less, and a line expansion coefficient ratio between the flow direction and a normal direction of the flow direction is 0.55 or more.