The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Jun. 07, 1999
Peter R. Ewer, Surrey, GB;
Mark Steers, West Sussex, GB;
International Rectifier Corp., El Segundo, CA (US);
Abstract
A semiconductor device package is provided which can accommodate currents larger than those of similarly sized standard device packages such as the “TO-247” package. Higher currents are accommodated by allowing a larger semiconductor die to be mounted on the device's lead frame than can be mounted on a similarly sized standard package. An improved mold clamping area is also provided which reduces the area from which damaging moisture can enter the molded package and increases the distance required for moisture to contact the die. Clip arrangements are also provided to mount the device package to a circuit board or heat sink, thereby allowing the increased operating temperatures associated with the increased operating currents to be efficiently dissipated. The semiconductor device package has a lead frame having a large area paddle section and at least one leg extending therefrom, the lead frame being of substantially constant thickness, and the paddle section being continuous and free of openings therethrough. A semiconductor die is mounted to the paddle section of the lead frame, the semiconductor die occupying substantially all of the surface area of a side of the paddle section upon which the semiconductor die is mounted. The full surface of the die and at least the side of the paddle section upon which the semiconductor die is mounted are covered by a common and uninterrupted mold housing.