The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Nov. 12, 1997
Applicant:
Inventor:
Hideaki Kuroda, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A semiconductor device wherein in formation of the wiring connection, an opening is made up to the middle of the insulating film, a side wall is formed, a burying wiring with the lower portion is arranged, a pad is formed, and a pad is formed in a polyplug contact without a masking step. Further, a conductive material is filled in the hole in the insulating film, a hole is opened in this material, a side wall is formed on the inner wall, a shrunken contact is opened by using this as a mask, and the conductive material is filled.