The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Jan. 12, 1998
Alexander Boyd, Largs, GB;
William French, Glasgow, GB;
Stuart P. Lees, Gourock, GB;
Kenneth Skene Murray, Inverkep, GB;
Brian L. Robertson, Gourock, GB;
International Business Machines Corporation, Armonk, NY (US);
Abstract
Solder particles,are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate,. The contacts,are coated with a layer of flux,. A pick up head,is positioned in a reservoir,of solder particles,and particles are attracted to the apertures in the end,of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head,is positioned adjacent the substrate,and the particles,released. The particles,stick to the flux,coated on the contacts,. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs,and the reliefs reflowed again to attach the chip onto the contacts