The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2001

Filed:

Dec. 19, 1998
Applicant:
Inventors:

Jayoung Koo, Bridgewater, NJ (US);

Narasimha-Rao V. Bangaru, Annandale, NJ (US);

Glen A. Vaughn, Houston, TX (US);

Raghavan Ayer, Woodbridge, CT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 8/02 ; C21D 7/13 ; C22C 3/808 ;
U.S. Cl.
CPC ...
C21D 8/02 ; C21D 7/13 ; C22C 3/808 ;
Abstract

An ultra-high strength, weldable, low alloy steel with excellent cryogenic temperature toughness in the base plate and in the heat affected zone (HAZ) when welded, having a tensile strength greater than about 830 MPa (120 ksi) and a microstructure comprising (i) predominantly fine-grained lower bainite, fine-grained lath martensite, fine granular bainite (FGB), or mixtures thereof, and (ii) up to about 10 vol % retained austenite, is prepared by heating a steel slab comprising iron and specified weight percentages of some or all of the additives carbon, manganese, nickel, nitrogen, copper, chromium, molybdenum, silicon, niobium, vanadium, titanium, aluminum, and boron; reducing the slab to form plate in one or more passes in a temperature range in which austenite recrystallizes; finish rolling the plate in one or more passes in a temperature range below the austenite recrystallization temperature and above the Ar,transformation temperature; quenching the finish rolled plate to a suitable Quench Stop Temperature (QST); stopping the quenching; and either, for a period of time, holding the plate substantially isothermally at the QST or slow-cooling the plate before air cooling, or simply air cooling the plate to ambient temperature.


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