The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2001
Filed:
Feb. 08, 1999
Thomas Arthur Bett, Oshkosh, WI (US);
Tanakon Ungpiyakul, Neenah, WI (US);
Gerald Bernard Arseneau, Neenah, WI (US);
Kimberly-Clark Worldwide, Inc., Neenah, WI (US);
Abstract
Methods of controlling manufacturing processes manufacturing, for example, absorbent articles. A target parameter to be measured is established, as are acceptable conditions of the target parameter. The target parameter is detected with first and second replications of determinations of the condition of the goods using multiple independent determinors, for example multiple sensors, or multiple replications using a common determinator, for example software instructions for analyzing a full digital vision image. Multiple determinations are taken at sites which are selected for their prospects for indicating acceptable conditions of the parameter. The method includes developing a measurement strategy, programming a computer to use appropriate analysis tools to evaluate the determination signals, transmitting the signals to the computer, and processing the signals according to an appropriate method. A given parameter can be inspected at respective duplicative sites, at spaced sites or multiple times at the same site. The parameter can be detected using three or more replications of the condition of the goods, optionally including processing signals from respective first and second parameters according to two or more different analytical methods. Averaging may or may not be an appropriate analytical method. The inspection system can compensate for various types of erroneous otherwise inappropriate signals and develop a corresponding response to respective process control devices. First and second replications can be taken at a common work station, or at spaced work stations. Preferably, the method measures parameters on every unit of goods fabricated or otherwise manipulated on the manufacturing line.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile