The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2001
Filed:
Apr. 14, 1999
Hideo Kunii, Osaka, JP;
Toshiyuki Take, Osaka, JP;
Hiroshi Inoguchi, Osaka, JP;
Tsutomu Ishikawa, Osaka, JP;
Masashi Arai, Osaka, JP;
Hiroshi Kobori, Osaka, JP;
Hiroki Seyama, Osaka, JP;
Kiyoshi Takada, Osaka, JP;
Satoru Sekiguchi, Osaka, JP;
Sanyo Electric Co., Ltd., Moriguchi, JP;
Abstract
A mold,for molding semiconductor chips,and,serving as a light emitting element and a light receiving element, respectively, is made of a material capable of transmitting light. A groove,is formed on the region where light is emitted from and incident on the semiconductor chips so that it constitutes a reflecting face. Thus, the light is emitted and incident through the side E of the mold. In this configuration, the outer size of the light receiving element or light emitting element can be minimized, and the module provided with these semiconductor chips can also be miniaturized.