The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2001
Filed:
Mar. 23, 2000
Applicant:
Inventor:
Kevin A. McCullough, Warwick, RI (US);
Assignee:
Chip Coolers, Inc., Warwick, RI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/38 ; C08K 3/22 ; C08K 3/10 ; C08K 3/04 ;
U.S. Cl.
CPC ...
C08K 3/38 ; C08K 3/22 ; C08K 3/10 ; C08K 3/04 ;
Abstract
A conductive net-shape moldable molding composition, with a thermal conductivity above 22 W/m°K and a volume electrical resistivity of 0.1 ohm-cm or lower and a surface electrical resistivity of 1.0 ohm or lower, is provided. The thermally and electrically conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.