The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2001
Filed:
Jul. 23, 1999
Friedrich Siebers, Nierstein, DE;
Dietrich Mund, Obersüssbach, DE;
Hartmut Paschke, Ergolding, DE;
Hans-Werner Beudt, Wiesbaden, DE;
Schott Glas, Mainz, DE;
Abstract
An improved filling material for a composite solder glass based on doped PbTiO,is disclosed, in which up to 35 atom % of the Pb atoms and up to 35% Ti atoms are replaced by Mg and/or Ca and a portion of O atoms in the doped PbTiO,is replaced with halogen atoms, preferably fluorine atoms. This filling material and composite solder glasses containing it are useful for hermetic sealing, soldering and/or coating of individual components made of glass material, glass-ceramic material, ceramic material and metal in the manufacturing of components and devices for electrical engineering and electronics, for hermetic encapsulation of electronic components, vacuum-tight seals or closures of display tubes or for display devices. They are also useful for coating and bonding of special glasses. The filling material can be made by reaction sintering of a powder mixture at temperatures of 800° C. to 1250° C.