The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2001

Filed:

May. 13, 1999
Applicant:
Inventors:

Kiyoshi Shimojima, Ibaraki, JP;

Seigi Aoyama, Ibaraki, JP;

Hideo Kawano, Ibaraki, JP;

Koichi Tamura, Ibaraki, JP;

Takahiro Sato, Ibaraki, JP;

Takamitsu Kimura, Ibaraki, JP;

Masato Watabe, Ibaraki, JP;

Assignee:

Hitachi Cable Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 2/100 ; B21D 3/500 ; B21D 3/900 ;
U.S. Cl.
CPC ...
B21D 2/100 ; B21D 3/500 ; B21D 3/900 ;
Abstract

The invention relates to a method for manufacturing an electrode wire for an electrical discharge machining apparatus, which is composed of a core wire formed of Cu or Cu-alloy and a covering layer formed of brass. A brass tape is longitudinally applied around a core wire to provide a pipe, a seam formed by butting longitudinal edges of the brass tape is continuously welded to provide a composite wire, area-reduction process of reduction rate less than 65% is applied to the brass pipe by means of a squeezing die, a heat treatment at a temperature higher a recrystallization one of brass is applied to the composite pipe, and thereafter the composite wire is processed to be reduced in area through plural reducing dies step by step.


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