The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Sep. 22, 1998
Stanislav P. Bajuk, Austin, TX (US);
Cathy L. Blouin, Franklin, VT (US);
Gregory A. Blunt, Essex Junction, VT (US);
Gary D. Boldman, Jericho, VT (US);
Robert C. Juba, Manasas, VA (US);
Daniel A. McAuliffe, Burlington, VT (US);
Peter J. Miller, Essex Junction, VT (US);
Stephanie A. Miraglia, Burlington, VT (US);
Thomas C. Richardson, Huntington, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of, computer system for, and computer program product for causally relating costs to products, including relating costs to a wafer having semiconductor chips comprising identifying resource costs for manufacturing the wafer including identifying equipment costs, computing load factors for each of the resource costs (the computing load factors for the equipment costs comprising determining a number of exposure fields on the wafer, computing a raw processing time for the wafer based on the number of exposure fields, and determining a percentage the raw processing time represents of a manufacturing time period on an equipment element, the equipment element having the equipment costs), producing weighted resource costs based on the resource costs and the load factors, (the producing weighted resource costs for the equipment costs comprising multiplying the equipment costs by the percentage), summing the weighted resource costs for the wafer, determining a volume of the wafer manufactured, and dividing the weighted resource costs by the volume to produce a weighted cost per wafer.