The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Jun. 11, 1999
Applicant:
Inventors:
Hiroshi Kamada, Shiga, JP;
Naoharu Fukuhara, Shiga, JP;
Katuya Terai, Shiga, JP;
Hiroshi Katoh, Shiga, JP;
Assignee:
NEC Corporation, Toyko, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/306 ;
U.S. Cl.
CPC ...
H01L 2/306 ;
Abstract
A ceramic package type electronic part for accommodating an electronic device includes a ceramic package body, an electrode, and a conductive adhesive. The electrode is disposed for the ceramic package body and is to be bonded to the electronic device. The conductive adhesive bonds the electronic device and the electrode to each other. The conductive adhesive is provided to be extended to a specific surface portion of a surface portion of the ceramic package body, from a bonding portion of the electronic device and the electrode.