The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2001

Filed:

Mar. 04, 1999
Applicant:
Inventors:

Jun Shinohara, Chiba, JP;

Kazuyoshi Furuta, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F04B 1/700 ;
U.S. Cl.
CPC ...
F04B 1/700 ;
Abstract

A micropump comprises a first substrate, a pumping section formed in the first substrate, a second substrate connected to the first substrate and having an inlet port and an outlet port, and at least two valve sections formed in the first substrate for controlling the flow of fluid from the inlet port to the outlet port through the pumping section. The pumping section has a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element to control the flow of fluid into and out of the pumping section. Each of the valve sections has a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element. A flow passage is formed in the first substrate for connecting the pumping section and the valve sections in fluid communication. A plurality of packing members are each disposed between a respective diaphragm of the valve sections and the second substrate for blocking the flow of fluid when no voltage is applied to the piezoelectric: elements of the valve sections. The packing members are operative to permit the flow of fluid through the valve sections when a voltage is applied to the piezoelectric elements of the valve sections to cause the diaphragms of the valve sections to undergo deformation and form a gap between each of the packing members and the second substrate or between each of the packing members and a respective diaphragm of the valve sections.


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