The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Apr. 29, 1998
James A. Harden, Jr., Colorado Springs, CO (US);
Randall J. Boudreaux, Colorado Springs, CO (US);
Medallion Technology, LLC, Houston, TX (US);
Abstract
A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (,) and a flexible circuit (,). Solder is applied to the connection surfaces of the printed circuit board (,), and the connection surfaces of the flexible circuit (,) are tinned. The circuit board (,) and flexible circuit (,) are then positioned so that the connections surfaces of each are in alignment and a gap exists between circuit board (,) and flexible circuit (,). The gap between circuit board (,) and flexible circuit (,) is precisely controlled and permits the solder of the printed circuit to be in contact with the connection surfaces of the flexible circuit (,). The solder is reflowed by applying heat by vapor phase condensation.