The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2001

Filed:

Jan. 10, 2000
Applicant:
Inventors:

Ichiro Kawakatsu, Tokyo, JP;

Takashi Uetani, Osaka, JP;

Assignee:

Hakko Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/02 ; B23K 3/03 ; B23K 1/012 ; B23K 9/16 ; H05B 1/00 ;
U.S. Cl.
CPC ...
B23K 3/02 ; B23K 3/03 ; B23K 1/012 ; B23K 9/16 ; H05B 1/00 ;
Abstract

A soldering iron device has a gas passage formed by enclosing a soldering iron tip,of an electric soldering iron with double pipes,and,to make a nozzle. By providing projections A, B and C in the spacing between said double pipes, the double pipes are prevented from any eccentricity and biasing, and the velocity of an inert gas G to be supplied is made slow to ensure that the gas is jet through the nozzle tip end. Further, engulfing of oxygen in the atmospheric air can be suppressed, whereby it is possible to prevent defective wetting of solder due to high temperature oxidation of the soldering iron tip and to suppress high temperature oxidation of workpieces and flux cored solder alloy and flux, and excellent solderability is obtained.


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