The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Dec. 14, 1999
Michihiko Ichinose, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device of a BGA (Ball-Grid-Array) package comprises a lead frame, a semiconductor chip, bonding wires, a plastic, an insulation film, and solder balls. The semiconductor chip is mounted on one side of the lead frame, and is electrically connected to the lead frame by the bonding wires. The plastic encapsulates the semiconductor chip and the bonding wires. The insulation film has openings for exposing predetermined regions of the lead frame. The insulation film is affixed onto an underside surface of the lead frame. The solder balls act as connection terminals. The solder balls are formed on the regions of the lead frame exposed through the openings in the insulation film.