The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Jul. 03, 1997
Applicant:
Inventors:
Hiroshi Sugimoto, Ibaraki, JP;
Shigeo Hagiya, Ibaraki, JP;
Noriaki Taketani, Ibaraki, JP;
Takaharu Yonemoto, Ibaraki, JP;
Osamu Yoshioka, Ibaraki, JP;
Assignee:
Hitachi Cable, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A lead frame is provided which enables a coating of an insulating adhesive for fixing a semiconductor chip to be evenly and thickly foamed on inner leads. In a lead frame wherein an insulating adhesive for fixing a semiconductor chip is applied to a semiconductor chip mounting region, inner leads,are set to a value of w/s of not more than 1 wherein w represents the lead width and s represents the lead spacing.
Sugimoto, Hiroshi. (2001). Lead frame (U.S. Patent No. 6246106). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6246106
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile