The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Mar. 11, 1999
Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board
Applicant:
Inventors:
Robert J. Roessler, Rowlett, TX (US);
William L. Woods, Jr., Kaufman, TX (US);
Assignee:
Lucent Technologies, Inc., Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/09 ;
U.S. Cl.
CPC ...
H01R 9/09 ;
Abstract
An edge-mountable integrated circuit (IC) package and methods of manufacturing and assembling the same onto a printed wiring board (PWB). In one embodiment, the package includes: (1) a substrate having a major surface and a substantially planar edge and (2) a conductive coating having a first region located on a portion of the major surface and a second region located on a portion of the substantially planar edge, the second region being substantially planar to allow the second region to be reflow soldered to the adjoining printed wiring board PWB.