The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Sep. 28, 1999
Applicant:
Inventor:
Joseph Fernandez, Gilbert, AZ (US);
Assignee:
Microchip Technology Incorporated, Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/328 ;
Abstract
The method which applies to plastic encapsulated integrated circuit packages comprises the steps of increasing the thickness of the epoxy adhesive that is used to couple an integrated circuit die to a mounting structure and reducing the thickness of the integrated circuit die. Each step may be taken independently or concurrently.