The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Oct. 07, 1999
James Barry Colvin, Newark, CA (US);
Other;
Abstract
A system and method for preparing semiconductor samples for analytical techniques such as backside emission microscopy. Samples may be prepared from a wafer or packaged die. In package form, the package is affixed to a polishing jig such that the backside of the die is oriented to face a polishing wheel. The package material is removed until die attach paddle and the backside of the die are exposed. The material is further removed until a selected thinness of the die is obtained. If the package's leadframe or a portion thereof remains after the removal of package material, a suitable testing fixture is attached thereto. If the leadframe is sacrificed, wire spots on the polished side of the semiconductor die are wire-to-wire bonded to a second leadframe's conductive fingers. In wafer form, the die is separated and encapsulated with a suitable substantially rigid material to form a substantially rigid body that is affixed to the polishing jig.