The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Aug. 28, 1996
Ren-Kae Shiue, Taipei, TW;
Thomas W. Eagar, Belmont, MA (US);
Bradley Miller, Westboro, MA (US);
Sergej-Tomislav Buljan, Acton, MA (US);
Norton Company, Worcester, MA (US);
Abstract
A bond for a metal single layer abrasive tool can be easily chemically and electrochemically stripped from the metal core of a recovered used tool to facilitate reuse of the core. Relative to conventionally bonded tools, the speed of stripping the novel bond is quick, and the stripped core has a smooth, clean surface which needs only minimal mechanical repair prior to reuse. The composition of the novel bond consists essentially of copper, tin and titanium. It can be brazed at temperatures below diamond graphitization and is chemically compatible with diamond. Hence, the bond is particularly useful for the manufacture of large diameter, superabrasive metal single layer abrasive wheels employed in the construction industry. The bond can be applied to the cutting surface of the abrasive tool as a uniform mixture of bronze alloy, titanium compound and copper powders. The powders may be mixed with a liquid vehicle and applied as a paste. The method of brazing the bond incorporates heating the bond composition to a temperature at most about 880° C. to melt the bronze alloy and titanium compound components, and raising the temperature to at least about 900° C. to dissolve the copper. The bond can also include an about 10-200 &mgr;m thick barrier layer of copper coating the cutting surface between the core and the bond composition.