The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Nov. 22, 1999
Rob Lee Jacobs, Woodstock, GA (US);
Billy Ray Jones, Jr., Hendersonville, NC (US);
Steven Edward Knothe, Roswell, GA (US);
Daniel Kenneth Schiffer, Marietta, GA (US);
Kimberly-Clark Worldwide, Inc., Neenah, WI (US);
Abstract
Process for die extrusion of melted polymers that reduces die lip buildup and its deleterious effects. Direct extrusion of mixed polymer pellets and filler concentrate pellets in one embodiment avoids a precompounding step and reduces the tendency of polymer and filler particles to adhere to the exit portion of the die. In other embodiments a reduced die lip radius and lower melt processing temperatures further enhance the benefits obtained. For co-extruded muitilayer film embodiments elimination of fillers and antiblock additives in skin layers add to the levels of die lip buildup reduction obtained. Hours of continuous operation without excessive die lip buildup in one arrangement have been increased from a level of 4 to 6 hours, for example, to in excess of 20 hours. Reduced product defect levels have also been attained.