The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Jun. 18, 1999
Applicant:
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 ;
U.S. Cl.
CPC ...
H05K 3/30 ;
Abstract
The method of manufacturing electronic parts comprises the steps of: preparing a mother board; mounting element parts on the mother board; providing a thermosetting resin on a surface of the mother board surface on which the element parts are mounted; semi-curing the thermosetting resin so as to be in a range of a stage B condition of the thermosetting resin; splitting the mother board with the thermosetting resin into individual electronic parts each having a divided mother board, at least one element part and the thermosetting resin thereon; and heating the individual electronic parts so that the thermosetting resin in the stage B condition melts first and is then cured permanently.