The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2001

Filed:

May. 18, 1998
Applicant:
Inventors:

David I. Stones, Torrance, CA (US);

Alfred E. Lee, Torrance, CA (US);

Assignee:

TRW Inc., Redondo Beach, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/68 ; H01P 5/107 ; H01P 5/12 ;
U.S. Cl.
CPC ...
H03F 3/68 ; H01P 5/107 ; H01P 5/12 ;
Abstract

An SSPA module in accordance with the present invention comprises a signal input (,), and a radial splitter (,) connected to the signal input (,) comprising a plurality of radially extending splitter waveguides,. The SSPA module also includes a signal output (,), and a radial combiner (,) connected to the signal output (,) comprising a plurality of radially extending combiner waveguides,. Connections between the splitter (,) and combiner (,) are provided by a plurality of vertically extending waveguides,. The SSPA module also includes a plurality of processing circuits,, for example MMIC amplifiers, connected to the combiner waveguides,. A waveguide to microstrip transition (,) may also be used to connect signals propagating in the waveguides to and from microstrip lines connected to the processing circuitry (,). Generally, the transition (,) includes a waveguide section (,) with a top conducting layer (,) that defines a first slit (,) and a second slit (,) bounding a transition area (,) abutting a microstrip section (,) to form a waveguide to microstrip transition.


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