The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2001
Filed:
Jan. 13, 1999
Applicant:
Inventors:
Makoto Fukuda, Osaka, JP;
Masanori Chikuba, Osaka, JP;
Assignee:
Sumitomo Special Metals Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23H 1/00 ; B23H 7/02 ; B23H 9/02 ;
U.S. Cl.
CPC ...
B23H 1/00 ; B23H 7/02 ; B23H 9/02 ;
Abstract
A method for manufacturing thin-plate sintered compacts according to the present invention includes the steps of: forming a conductive sintered compact to have such a thickness as to cause a warp to a negligible degree; and slicing the conductive sintered compact, thereby cutting and dividing the conductive sintered compact into at least two wafers.
Quick Actions:
Fukuda, Makoto. (2001). Method for manufacturing conductive wafers, method for manufacturing thin-plate sintered compacts, method for manufacturing ceramic substrates for thin-film magnetic head, and method for machining conductive wafers (U.S. Patent No. 6242709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6242709
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile