The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2001
Filed:
May. 05, 1999
Applicant:
Inventors:
Günter Herklotz, Bruchköbel, DE;
Lutz Schräpler, Karlstein, DE;
Christoph Simons, Biebergemünd, DE;
Jürgen Reuel, Gelnhausen, DE;
Y. C. Cho, Inchon, KR;
Assignee:
W. C. Hereaeus GmbH & Co. KG, Hanau, DE;
Primary Examiner:
Int. Cl.
CPC ...
C22C 5/02 ; H01B 1/02 ;
U.S. Cl.
CPC ...
C22C 5/02 ; H01B 1/02 ;
Abstract
A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.