The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2001

Filed:

Jan. 12, 2000
Applicant:
Inventor:

Michael L. Miller, Cincinnati, OH (US);

Assignee:

General Electric Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 8/00 ;
U.S. Cl.
CPC ...
C21D 8/00 ;
Abstract

A method and device for thermal creep-sizing an annular-shaped structure. The creep-sizing device includes a ring member with through-holes present between the inner and outer diametrical boundaries of the ring member, and with through-slots alternatingly extending from each through-hole to either the inner or outer diametrical boundary. In use, the ring member is placed within the annular-shaped structure, and pins are installed in the through-holes in the ring member to cause the outer diametrical boundary of the ring member to diametrically expand. The structure and creep-sizing device are then heated so that the mechanically expanded ring member causes the structure to undergo thermal creep-sizing.


Find Patent Forward Citations

Miller, Michael. (2001). Method for creep-sizing annular-shaped structures and device therefor (U.S. Patent No. 6241832). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6241832

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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