The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2001
Filed:
Dec. 22, 1998
Applicant:
Inventors:
Takehito Matsubara, Kyoto, JP;
Shinichi Jinushi, Kyoto, JP;
Toshio Murata, Kyoto, JP;
Yasuaki Hiramura, Kyoto, JP;
Yasuyuki Ida, Kyoto, JP;
Kazuya Miyazaki, Kyoto, JP;
Yasuaki Ito, Kyoto, JP;
Saburo Komai, Kyoto, JP;
Haruhiko Takemura, Kyoto, JP;
Assignee:
Other;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 6/00 ; H01M 4/02 ; H01M 4/74 ;
U.S. Cl.
CPC ...
H01M 6/00 ; H01M 4/02 ; H01M 4/74 ;
Abstract
In a process for the production of an electrode for cell, a three-dimensional porous metal substrate is filled with an active material filler containing an active material. Then, heat and ultrasonic vibration is applied in order to denature or deform the active material filler to the substrate at a predetermined point where a collector leading portion is formed to remove the active material filler.