The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2001
Filed:
Apr. 21, 2000
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; B23K 3/522 ;
U.S. Cl.
CPC ...
B23K 3/102 ; B23K 3/522 ;
Abstract
A joining method using lead-free solder which can produce a good joint through a heating process. A first lead-free alloy layer is formed on surfaces of all parts to be mounted on a board at a temperature equal to or lower than the melting point of the first alloy layer. A second lead-free alloy layer having a melting point lower than the first alloy layer is formed on surface of the board. The first and second alloy layers are placed in contact with each other and heated to a predetermined temperature.