The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2001
Filed:
Dec. 13, 1999
Matthew A. Tehan, Albuquerque, NM (US);
Armand Losinski, Albuquerque, NM (US);
Jay Berkley Parkinson, Albuquerque, NM (US);
Honeywell International Inc., Morristown, NJ (US);
Abstract
An integrated thermal management system for electronic devices includes a printed wiring board for supporting electronic devices, at least one die-up and one die-down electronic device, a frame and a heat sink. The board includes at least one thermally conductive layer, to which the die-down device is thermally connected. The frame member, which includes at least a first heat sink mounting location, is connected to one of the first and second surfaces of the board, adjacent to the edge. The heat sink itself, which is cantilevered over the die-up electronic device from at least one heat sink mounting location, includes a portion which is adapted to engage the die-up electrical device, a portion connected to the frame member to provide a conductive path from the die-up device to the frame member, and a convective cooling portion. The thermal management structure also includes a cold wall, which engages the frame to provide a thermally conductive connection between the frame member and the cold wall. The heat sink(s) covers only the die-up electronic device(s) and those portions of the board surface(s) between the die-up electronic device(s) and the frame necessary to thermally connect the die-up electronic device(s) to the frame, to thereby provide access to the board surfaces for inspection or testing without removal of the heat sink(s).