The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2001
Filed:
Jan. 11, 2000
Kenzo Tanaka, Kagoshima, JP;
Takahiro Yotsumoto, Kagoshima, JP;
Sony Corporation, Tokyo, JP;
Abstract
Fabrication of a semiconductor device, with an improved level of exposure of the rear surface of a die pad is enabled during the fabrication of which deformation of a die pad in a resin-encapsulating step is prevented from occurring, and which can be mounted on a printed wiring board with a sufficient soldering strength. In a resin-encapsulated semiconductor device in which a semiconductor element is placed on the front surface of a die pad of a lead frame including: the die pad; and support bars of the die pad that protrude outwardly from sides of the die pad, the semiconductor element and its periphery are encapsulated with a resin material while the rear surface of the die pad is exposed to the external environment, a groove is formed on the rear surface of the support bar so that the groove traverses the support bar in the neighborhood of the boundary between the support bar and the die pad along a direction intersecting a protruding direction of the support bar. The groove may be formed on the front surface of a support bar.