The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2001
Filed:
Mar. 27, 2000
James H. Howser, Richardson, TX (US);
Tom L. Fowler, Garland, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A multi-component electronic assembly (,) including a leadframe (,) having upper and lower surfaces and a plurality of conductive leads (,). Each lead (,) has first bonding surfaces (,) on the upper surface of each lead and second bonding surfaces (,) on the lower surface of each lead (,). Preferably, each lead has a plurality of third bonding surfaces (,) formed on at least some of the plurality of leads where the third bonding surfaces (,) are formed by conductive extensions of the leads (,) that extend towards the center of the assembly (,). A first passive component (,) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (,) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (,) are used, a third component (,) is electrically and mechanically coupled to the third bonding surfaces (,).